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OKI develops Tiling crystal film bonding
What happened
Oki Electric Industry has developed a 'Tiling crystal film bonding' technology that enables the integration of small optical semiconductor wafers onto 300mm silicon wafers. This addresses previous wafer size limitations and aims to advance photonics-electronics convergence technology. Neutral: This is a long-term R&D milestone with no immediate impact on component supply, pricing, or trader decisions.
Impact and signal
Low impactImpact score: 8/100
Affected components and suppliers
Optical Semiconductor WafersSilicon Wafers
Oki Electric Industry Co Ltd
rd-milestoneheterogeneous-integrationphotonics-electronics-convergence
Source and time
Source: Semiconductor Today · 8/18/2025 · View original source
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