NuAxiSemiconductor trade intelligence

SK Hynix bets on EUV to extend 6F² DRAM as CXMT pushes 4F²

What happened

SK Hynix plans to extend the life of its existing 6F2 DRAM cell architecture through extreme ultraviolet (EUV) lithography and process improvements, keeping 4F2 and three-dimensional (3D) DRAM on its technology roadmap, while China's ChangXin Memory Technologies (CXMT) prepares to unveil a product based on a smaller cell design. These remain plan/preparation stages; the source does not state the cause.

Impact and signal

Medium impactImpact score: 55/100

Affected components and suppliers

6F2 DRAM4F2 DRAM3D DRAM

SK HynixChangXin Memory Technologies (CXMT)

EUVDRAM cell architecturetechnology roadmap6F24F23D DRAM

Source and time

Source: DigiTimes Asia · 10/27/2026 · View original source

Open the NuAxi live feed →

Real-time pricing, supply signals and AI analysis for semiconductor traders

RT NEWS: #SKhynix is in no rush for 4F² DRAM: Park Joon-deok, Head of DRAM Marketing, said on its Q3 call it will keep leveraging 6F² with #EUV scal...TrendForce Official (Market Data) · 10/28/2026
Micron Walks Away From 4F² DRAM After Two Decades of Research, Bets on 3D DRAM InsteadTechPowerUp · 10/22/2026
CXMT targets 4F² DRAM production two years ahead of Samsung, but can China close technology gap?DigiTimes Asia · 10/13/2026
[News] SK hynix Eyes EUV-Driven 6F² Scaling, Keeps 4F² and 3D DRAM in Play as Micron Holds BackTrendForce · 10/27/2026
Micron skips 4F² for 3D DRAM as CXMT pushes aheadDigiTimes Asia · 10/21/2026
SK Hynix advances chip inspection technology as 3D memory pushes conventional metrology to its limitsDigiTimes Asia · 10/18/2026

SK Hynix bets on EUV to extend 6F² DRAM as CXMT pushes 4F²

What happened

Impact and signal

Affected components and suppliers

Source and time

Related briefings