[News] Starksemi’s Micro LED Optical Interconnect Passes Technical Validation by Leading Customer

What happened

On October 20, Starksemi announced that its Micro LED optical interconnect project had completed technical validation by a leading customer and officially entered the product development phase; the solution is based on an 8-inch silicon-based GaN epitaxy platform and hybrid bonding technology, targets high-speed interconnects for AI data centers, and the company will further optimize the design based on customer feedback before proceeding with engineering samples. It previously completed design of experiments (DOE) validation, conducting comparative tests on Micro LEDs ranging from 5μm to 30μm as well as different epitaxial approaches and chip structures. Background: Starksemi was founded in 2022, established operations in Wuhan's East Lake High-Tech Development Zone in October 2024, and in September 2025 completed an 8-inch silicon-based GaN Micro LED pilot production line with a planned annual capacity of approximately 12,000 wafers; in May 2026 it launched a full range of red, green, and blue Micro LED microdisplay panels; in October, a red-and-green stacked microdisplay prototype developed with U.S.-based Inlighten Technologies was showcased at Micro LED-Connect 2026 in Eindhoven, the Netherlands; in September 2026 it raised more than CNY 1 billion in a round led by CATL's Puquan Capital with Meituan Longzhu and Guotai Haitong among participants, bringing cumulative funding to over CNY 2.5 billion.

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Source and time

Source: TrendForce · 10/27/2026 · View original source