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Applied Materials to raise Besi stake to 20% as hybrid-bonding orders surge
What happened
Applied Materials plans to increase its stake in Dutch semiconductor equipment maker BE Semiconductor Industries (Besi) to approximately 20% from 9%, deepening its involvement in advanced chip packaging as demand for hybrid-bonding equipment accelerates. The stake increase is a plan; the source does not state the cause.
Impact and signal
Medium impactImpact score: 45/100
Affected components and suppliers
hybrid-bonding equipment
Applied MaterialsBE Semiconductor Industries (Besi)
stake increaseadvanced chip packaginghybrid bondingequity investment
Source and time
Source: DigiTimes Asia · 10/26/2026 · View original source
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