NuAxiSemiconductor trade intelligence
US signs up to US$389 million in CHIPS R&D deals for power chips and fusion
What happened
The US Department of Commerce signed letters of intent with four companies on October 22, 2026, to provide up to US$389 million in federal research and development awards under the CHIPS and Science Act, targeting the semiconductors and materials used to control, convert, and deliver power.
Impact and signal
Low impactImpact score: 0/100
Affected components and suppliers
semiconductors and materials used to control, convert, and deliver power
CHIPS ActR&DPower ChipsFusionUS Department of Commerce
Source and time
Source: DigiTimes Asia · 10/22/2026 · View original source
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