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SK Hynix reportedly engages suppliers to bring 30% more efficient iHBM cooling to HBM5 production
What happened
According to reports, SK Hynix is reportedly working with materials and equipment suppliers to commercialise its next-generation iHBM cooling technology, targeting a reduction of more than 30% in thermal resistance, with the technology intended for HBM5 production. The initiative aims to address mounting heat dissipation challenges in HBM and strengthen the company's competitiveness in AI memory. The claim is reported ("reportedly") and describes a planned development effort; commercialisation and mass production are not confirmed as achieved.
Impact and signal
Medium impactImpact score: 50/100
Affected components and suppliers
HBM5iHBM cooling technology
iHBMHBM5cooling technologyAI memorysupplier collaborationthermal resistance
Source and time
Source: DigiTimes Asia · 10/22/2026 · View original source
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