UMC, AP Memory advance AI chip power delivery with validated DTC silicon capacitors for advanced packaging

What happened

UMC and AP Memory announced a technology and manufacturing partnership on October 22 to develop next-generation power delivery solutions for AI data centers, combining UMC's deep trench capacitor (DTC) technology and wafer manufacturing capabilities with AP Memory's silicon capacitor design and system integration expertise. The collaboration comes as rising power consumption in AI and high-performance computing (HPC) chips accelerates the shift towards near-chip power delivery and advanced packaging integration. This is an announced partnership covering the development of next-generation power delivery solutions for AI data centers.

Impact and signal

Affected components and suppliers

Source and time

Source: DigiTimes Asia · 10/22/2026 · View original source