NuAxiSemiconductor trade intelligence
RT NEWS: China’s chip equipment makers are pushing into #hybridbonding. #NAURA has signed a RMB 405M acquisition deal to boost its 3D integration cap...
What happened
NAURA has signed an acquisition deal worth RMB 405M aimed at boosting its 3D integration capabilities and pushing into hybrid bonding. The item was reposted by TrendForce; the source states only that the deal has been signed and does not state whether the acquisition has been completed, implemented, or approved.
Impact and signal
Medium impactImpact score: 45/100
Affected components and suppliers
hybrid bonding equipment
NAURA
NAURAhybrid bondingacquisition3D integrationadvanced packagingChina domestic equipment
Source and time
Source: TrendForce Official (Market Data) · 10/20/2026 · View original source
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