Shindo Eng Lab Proposes 3D Chip Packaging With HBM Stacked Beneath GPU

What happened

Shindo Eng Lab, a display bonding equipment maker, unveiled a chip packaging architecture at SEMICON West 2026 in San Francisco on Oct. 15 local time that vertically stacks a graphics processing unit (GPU) and high-bandwidth memory (HBM) with a glass-ceramic interposer approximately 200 micrometers (μm) thick between them. In the proposed structure, the GPU sits above and the HBM below the interposer, and the two chips are connected through vertical conductive vias in the interposer; liquid cooling modules are attached above the GPU and below the HBM to dissipate heat in opposite directions, and power is delivered from a printed circuit board (PCB) at the bottom through metal pillars to the interposer, which distributes it to both chips. According to the source, current AI semiconductor packages use a 2.5D architecture that places GPUs and HBM side by side on a silicon interposer; vertical stacking shortens the distance between chips but creates challenges including concentrated heat and warpage caused by thermal expansion and contraction, and Shindo claims its glass-ceramic interposer, which allows thermal expansion characteristics to be adjusted, combined with cooling on both sides can mitigate these problems. The technology used to form the vertical conductive vias is Through Glass-Ceramic Via (TGCV), which the company unveiled in September; the process uses photolithography to form hole patterns simultaneously in a glass-ceramic substrate before filling them with copper, and Shindo initially introduced TGCV as a potential replacement for organic cores in flip-chip ball grid array (FC-BGA) substrates. Shindo has primarily supplied lamination and vacuum bonding equipment used to attach display panels to cover windows and has no previous experience in the semiconductor substrate business. The company has filed a patent application for the proposed architecture and is holding technical discussions with approximately 10 companies, having provided samples to some of them; it has not disclosed whether it intends to manufacture and sell interposers directly or supply equipment. A Shindo official said the ultimate goal is to implement a 3D architecture that vertically integrates GPUs and HBM using TGCV as the underlying technology, and the company plans to present the structure to outsourced semiconductor assembly and test (OSAT) companies and discuss potential applications. The architecture remains a proposal; no mass production or commercialization is reported.

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Source and time

Source: The Elec · 10/19/2026 · View original source