Infineon secures 200mm SiC wafer supply from Wolfspeed

What happened

Infineon has signed a multi-year agreement with Wolfspeed for the supply of 200mm silicon carbide (SiC) wafers, moving the companies' existing supply relationship from 150mm to 200mm substrates. According to an Infineon press release, the agreement supports Infineon's conversion from 150mm to 200mm SiC manufacturing. Infineon sources SiC substrates from several suppliers for its global manufacturing network, which includes its 200mm SiC fab in Kulim, Malaysia, and says this multi-source strategy is meant to secure both flexibility and quality of supply. Infineon COO Alexander Gorski said the agreement further broadens the company's supply base for its 200-millimeter high-volume manufacturing, building on a 20-year supply relationship between the two companies. Moving to larger wafers is largely a question of cost: a 200mm wafer provides more usable die area than a 150mm wafer, which lowers the substrate cost per unit and improves overall manufacturing efficiency. Demand for SiC power semiconductors comes mainly from electric vehicle drivetrains, solar inverters and industrial motor drives, and Infineon also points to AI datacenters as an emerging demand driver. Neither company has disclosed the value of the agreement or the volumes involved.

Impact and signal

Affected components and suppliers

Source and time

Source: Evertiq · 10/15/2026 · View original source