NuAxiSemiconductor trade intelligence
MRSI launches latest die bonder for high-power laser makers
What happened
MRSI Systems (Mycronic Group) has launched the MRSI-H-HPLD+ die bonder, a new tool for high-power laser diode manufacturing, scheduled for availability in Q3 2022. This is an incremental update to their existing product line for specialized assembly equipment. Neutral: The launch of a new, specialized manufacturing tool does not directly impact the supply, demand, or price of electronic components for traders.
Impact and signal
Low impactImpact score: 15/100
Affected components and suppliers
High-Power Laser Diodes
equipmentmanufacturing-tools
Source and time
Source: Semiconductor Today · 7/13/2022 · View original source
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