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ACM introduces post-CMP cleaning tool for silicon and SiC substrate manufacturing

What happened

ACM Research has launched a new post-CMP cleaning tool for silicon and SiC substrate manufacturing. The tool aims to improve yield and throughput in advanced substrate processing. Neutral: This is a background technical development with no immediate, direct impact on component supply, demand, or pricing.

Impact and signal

Low impactImpact score: 10/100

Affected components and suppliers

SiC Substrates

ACM Research Inc

equipmentmanufacturingyield

Source and time

Source: Semiconductor Today · 7/13/2022 · View original source

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ACM introduces post-CMP cleaning tool for silicon and SiC substrate manufacturing

What happened

Impact and signal

Affected components and suppliers

Source and time

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