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Filtronic completes multi-year project to develop plastic QFN packaging for GaN devices
What happened
Filtronic plc has completed a multi-year R&D project to develop plastic QFN packaging for gallium nitride (GaN) devices. This development is framed as enhancing UK sovereign capability in advanced semiconductor packaging technology. Neutral: This is a long-term R&D milestone with no immediate impact on supply, demand, or pricing for electronic components.
Impact and signal
Low impactImpact score: 10/100
Affected components and suppliers
GaN RF DevicesQFN Packages
Filtronic plc
packagingR&DGaN
Source and time
Source: Semiconductor Today · 11/18/2025 · View original source
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