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Predicting Thermal Conductivity in Advanced BEOL Interconnect Stacks (Peking University)

What happened

Peking University researchers published a framework for predicting thermal conductivity in BEOL interconnect stacks. This addresses structural complexity in advanced nodes. Neutral: No immediate impact on spot prices or supply chain.

Impact and signal

Low impactImpact score: 0/100

Affected components and suppliers

BEOL Interconnect Stacks

Peking University

R&DTechnical

Source and time

Source: Semiconductor Engineering · 9/19/2026 · View original source

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Predicting Thermal Conductivity in Advanced BEOL Interconnect Stacks (Peking University)

What happened

Impact and signal

Affected components and suppliers

Source and time

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