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OIPT’s silicon carbide plasma epi-prep alternative to CMP validated
What happened
Oxford Instruments Plasma Technology (OIPT) has validated a plasma etch method for SiC substrate prep as an alternative to CMP, claiming lower OPEX and higher yield. The technique supports the industry transition to thinner wafers, potentially increasing usable material per boule. This is a long-term process efficiency improvement with no immediate impact on trading prices or supply.
Impact and signal
Low impactImpact score: 10/100
Affected components and suppliers
Silicon Carbide Substrates
Oxford Instruments Plasma Technology
process-innovationyield-improvementopex-reduction
Source and time
Source: Semiconductor Today · 9/1/2022 · View original source
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