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Clas-SiC qualifies Oxford Instruments’ contactless SiC plasma epi-prep
What happened
Clas-SiC has qualified Oxford Instruments' contactless plasma polishing solution for SiC substrates, validating it for 1200V MOSFET production. This dry process aims to replace traditional CMP with a higher-yield, lower-cost alternative. Neutral: This is a long-term process improvement with no immediate impact on component supply, pricing, or trader inventory decisions.
Impact and signal
Low impactImpact score: 12/100
Affected components and suppliers
SiC Epitaxial WafersSiC Power Semiconductors
Clas-SiC Wafer Fab LtdOxford Instruments Plasma Technology
manufacturing-yieldprocess-technologySiC
Source and time
Source: Semiconductor Today · 9/8/2022 · View original source
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