NuAxiSemiconductor trade intelligence

[Inside the Research] SK hynix’s CTI innovation advances 176-layer 3D NAND toward mass production

What happened

SK hynix developed CTI technology for 176-layer 3D NAND, reducing interference by over 30%, boosting charge retention by over 45%, and shrinking cell size by 10% to enable higher-density AI memory scaling.

Impact and signal

Low impactImpact score: 10/100

Affected components and suppliers

3D NAND Flash

SK hynix

scalingtechnologyR&D

Source and time

Source: SK Hynix Newsroom · 7/21/2026 · View original source

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[Inside the Research] SK hynix’s CTI innovation advances 176-layer 3D NAND toward mass production

What happened

Impact and signal

Affected components and suppliers

Source and time

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