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WAIC 2026: Enflame debuts China's first glass-based CoPoS AI chip sample
What happened
Enflame showcased a glass-based CoPoS AI chip sample at WAIC 2026, marking a panel-level advanced packaging innovation. This technology represents a significant R&D milestone for domestic AI chip packaging. The impact on current market supply and pricing is neutral as it is still in the sample stage.
Impact and signal
Low impactImpact score: 10/100
Affected components and suppliers
AI ChipGlass-based PackagingCoPoS
EnflameShanghai Xianfeng Technology
AI ChipPackagingR&D
Source and time
Source: DigiTimes Asia · 7/21/2026 · View original source
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