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🔥 #Intel is reportedly eyeing dual-side power delivery for 14A2. With M0 pitch shrinking to ~21nm from ~28nm on 14A, lithography limits are driving...

What happened

Intel is reportedly considering dual-side power delivery for its 14A2 process node to address lithography limits as M0 pitch shrinks to ~21nm. This technical shift aims to boost density but currently has no direct impact on market supply or pricing.

Impact and signal

Low impactImpact score: 5/100

Affected components and suppliers

工艺节点技术趋势英特尔

Source and time

Source: TrendForce Official (Market Data) · 7/6/2026 · View original source

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