NuAxiSemiconductor trade intelligence
CEA-Leti and Intel to co-develop atomically thin 2D TMDs on 300mm wafers
What happened
CEA-Leti and Intel announced a joint research project to develop layer transfer technology for 2D transition-metal dichalcogenides (TMDs) on 300mm wafers. The goal is to extend Moore's Law beyond 2030 by enabling advanced transistor channel materials. Neutral: This is a long-term R&D milestone with no immediate impact on component supply, pricing, or trading decisions.
Impact and signal
Low impactImpact score: 7/100
Affected components and suppliers
rd-milestoneadvanced-packaging
Source and time
Source: Semiconductor Today · 6/20/2023 · View original source
Open the NuAxi live feed →
Real-time pricing, supply signals and AI analysis for semiconductor traders