NuAxiSemiconductor trade intelligence
Post-silicon era gets closer as industry giants crack the 2D transistor scaling bottleneck with breakthrough tech — imec, ASML, and TSMC fab complementary 2D-material transistors at 50nm pitch on a 300mm wafer
What happened
imec, ASML, and TSMC have integrated complementary 2D transistors on a 300mm wafer with a 50nm pitch, marking a significant scaling milestone for post-silicon technology.
Impact and signal
Low impactImpact score: 10/100
Affected components and suppliers
2D MaterialsScalingR&D Milestone
Source and time
Source: Tom's Hardware · 6/19/2026 · View original source
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