NuAxiSemiconductor trade intelligence
Imec, Sony unveil backside interconnect method for 3D chip stacking
What happened
Imec and Sony Semiconductor Solutions have unveiled a new method for connecting the front and back sides of wafers to support future 3D chip-stacking designs for logic and memory devices.
Impact and signal
Low impactImpact score: 5/100
Affected components and suppliers
ImecSony Semiconductor Solutions Corporation
3D stackingR&Dbackside interconnect
Source and time
Source: DigiTimes Asia · 6/18/2026 · View original source
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