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OKI develops GaN lifting-off/bonding technology on Shin-Etsu’s QST substrates
What happened
Oki Electric, in collaboration with Shin-Etsu Chemical, has developed a CFB technology to lift off GaN functional layers from QST substrates and bond them to other materials. This R&D milestone aims to improve GaN device performance and manufacturing flexibility by separating the epitaxial layer from the growth substrate. Neutral: This is a long-term process development with no immediate impact on GaN wafer or device supply, pricing, or trader inventory decisions.
Impact and signal
Low impactImpact score: 10/100
Affected components and suppliers
GaN-on-Si Power DevicesGaN HEMT
Oki Electric Industry Co LtdShin-Etsu Chemical Co Ltd
R&Dmanufacturing-techsubstrate
Source and time
Source: Semiconductor Today · 11/14/2023 · View original source
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