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DOE launches $2.25m American-Made Silicon Carbide Packaging Prize
What happened
The U.S. DOE has launched a $2.25 million prize competition to develop advanced packaging prototypes for Silicon Carbide (SiC) semiconductors, targeting high-voltage applications like energy storage. This initiative is part of the American-Made Challenges program aimed at fostering domestic innovation. Neutral: This is a long-term R&D funding announcement with no immediate impact on SiC component supply, demand, or pricing for traders.
Impact and signal
Low impactImpact score: 10/100
Affected components and suppliers
SiC Power Devices
R&Dgovernment-fundingpackaging
Source and time
Source: Semiconductor Today · 2/27/2024 · View original source
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