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UMC introduces first 3D IC solution for RFSOI

What happened

UMC announced a 3D IC stacking solution for its 55nm RFSOI platform, claiming over 45% die size reduction with no RF performance loss. This technology aims to help customers integrate more RF components to meet 5G bandwidth demands. Neutral: This is a long-term R&D milestone with no immediate impact on component supply, pricing, or trader inventory decisions.

Impact and signal

Low impactImpact score: 12/100

Affected components and suppliers

RFSOI5G RF Front-End Modules

United Microelectronics Corp

technology-launch5Gfoundry

Source and time

Source: Semiconductor Today · 5/3/2024 · View original source

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UMC introduces first 3D IC solution for RFSOI

What happened

Impact and signal

Affected components and suppliers

Source and time

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