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CGD adds new ICeGaN power IC packages with enhanced thermal performance
What happened
Fabless firm CGD announced two new package variants for its ICeGaN family, offering enhanced thermal performance and simplified inspection. These DFN-style packages are designed to be rugged and reliable. 关注：新产品发布，短期供需影响有限。
Impact and signal
Low impactImpact score: 10/100
Affected components and suppliers
GaN power ICs
Cambridge GaN Devices Ltd
product_launchgallium_nitride
Source and time
Source: Semiconductor Today · 6/4/2024 · View original source
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