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TSMC targets 3nm production at second Japan fab by 2028

What happened

TSMC plans to install equipment and begin mass production of 3nm chips at its second Japan fab in 2028, targeting a monthly capacity of 15,000 12-inch wafers. This marks a strategic shift from focusing on mature nodes in Japan to advanced 3nm production. Bearish: This represents a significant long-term capacity addition for advanced logic, potentially easing future supply constraints and exerting downward pressure on premium node pricing.

Impact and signal

Medium impactImpact score: 58/100

Affected components and suppliers

3nm Logic
capacity-expansionadvanced-nodejapan

Source and time

Source: Evertiq · 4/1/2026 · View original source

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