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[News] Silai Semicon Achieves Scaled Delivery of 12-Inch SiC Laser Lift-Off Production Systems
What happened
Silai Semicon has delivered dozens of its 12-inch SiC laser lift-off production systems to multiple domestic manufacturers, with batch delivery cycles at 28 days. The LLO process claims to increase wafer output by 30% and reduce per-wafer processing costs by 50% compared to traditional wire-saw methods. 利多: This is a background technology development; the long-term impact on SiC wafer supply, cost, and potential downstream component pricing is positive but indirect and not immediate.
Impact and signal
Low impactImpact score: 15/100
Affected components and suppliers
SiC Substrates
equipmentyieldcost-reduction
Source and time
Source: TrendForce · 3/30/2026 · View original source
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