NuAxiSemiconductor trade intelligence

Samsung and SK hynix plan to adopt the 1c nm process for the memory die in HBM4e, while their base die process strategies will become a key focus goin...

What happened

Samsung and SK hynix plan to use 1c nm for HBM4e memory dies, while their base/logic die strategies diverge. SK hynix is exploring TSMC's 3nm for its base die, while Samsung will leverage its existing 4nm process. Neutral: This is a long-term R&D roadmap with no immediate impact on supply, pricing, or trading decisions.

Impact and signal

Low impactImpact score: 15/100

Affected components and suppliers

HBM4e

Samsung Electronics SK hynix TSMC

hbmprocess-noderd

Source and time

Source: TrendForce Official (Market Data) · 3/25/2026 · View original source

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Samsung and SK hynix plan to adopt the 1c nm process for the memory die in HBM4e, while their base die process strategies will become a key focus goin...

What happened

Impact and signal

Affected components and suppliers

Source and time

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