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Kulicke & Soffa Expands Memory-focused Interconnect Portfolio

What happened

K&S expands its memory interconnect portfolio covering ball grid array, vertical wire, advanced thermo-compression, and hybrid bonding technologies. This reinforces its leadership in advanced packaging. The impact on current spot prices is neutral.

Impact and signal

Low impactImpact score: 10/100

Affected components and suppliers

InterconnectWire BondingHybrid Bonding
Kulicke & Soffa
product_launchsupply

Source and time

Source: EE Times Asia · 3/24/2026 · View original source

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