NuAxiSemiconductor trade intelligence
[News] China Completed the World’s First 35-micron Ultra-Thin Wafer Process and Packaging & Testing Production Line
What happened
Nixi Semiconductor has completed a production line for 35-micron ultra-thin power semiconductor wafers, achieving mass production with a wafer breakage rate below 0.1% and a laser dicing yield of 98.5%. This fills a domestic technology gap and integrates the manufacturing chain from wafer processing to testing. Neutral: This is a long-term R&D milestone with no immediate impact on spot market supply, pricing, or trader decisions.
Impact and signal
Low impactImpact score: 12/100
Affected components and suppliers
Power Semiconductors
Nixi Semiconductor Technology (Shanghai) Co., Ltd.Alpha and Omega Semiconductor (AOS)
manufacturing-breakthroughdomestic-supply
Source and time
Source: TrendForce · 3/15/2026 · View original source
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