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Element Six unveils copper diamond composite to power advanced semiconductor devices
What happened
Element Six launched a copper-diamond composite material at Photonics West 2025, targeting thermal management in AI, HPC, and GaN RF devices. This is a technology announcement for a new material solution, not a report on market events. Neutral: This is a long-term R&D development with no immediate impact on semiconductor supply, demand, or pricing.
Impact and signal
Low impactImpact score: 15/100
Affected components and suppliers
Thermal Management MaterialsAdvanced Packaging Substrates
Element Six
product-launchthermal-managementadvanced-packaging
Source and time
Source: Semiconductor Today · 1/22/2025 · View original source
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