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University of Michigan awarded up to $7.5m to bring heat-resistant silicon carbide sensing and computing chips from lab to fab
What happened
The University of Michigan has been awarded up to $7.5 million to develop heat-resistant silicon carbide (SiC) sensing and computing chips. This funding aims to advance SiC technology for high-temperature applications in aircraft, electric vehicles, and defense. Neutral: This R&D milestone supports the long-term growth of the SiC market but has no immediate trading impact.
Impact and signal
Low impactImpact score: 10/100
Affected components and suppliers
Silicon Carbide (SiC) chipsSensing and computing chips
University of Michigan
R&DSiCFunding
Source and time
Source: Semiconductor Today · 2/21/2025 · View original source
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