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GUC Announces Tape-out of UCIe 64G IP on TSMC N3P Technology
What happened
GUC announced the successful tape-out of its UCIe 64G IP on TSMC's N3P process node. This is a technical milestone in chiplet interconnect technology development. Neutral: This R&D event has no immediate impact on component supply, demand, or pricing.
Impact and signal
Low impactImpact score: 8/100
Affected components and suppliers
UCIe IP
GUCTSMC
chipletadvanced-packagingR&D
Source and time
Source: EE Times · 2/26/2026 · View original source
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