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[News] TSMC Says CoWoS Offers Industry’s Largest Reticle-Size Packaging Amid Intel EMIB Rivalry; CoPoS Advances
What happened
TSMC announced its CoWoS advanced packaging capacity is projected to reach 115k-140k wafers/month by end of 2026 and 170k wafers/month in 2027, with expansion focused in Tainan and Chiayi. The company is also advancing its CoPoS panel-level packaging, with pilot line setup expected by June 2024 and mass production targeted for 2028-2029. 利多: Significant capacity ramp signals strong long-term supply commitment for AI/GPU packaging, but no immediate price impact.
Impact and signal
Medium impactImpact score: 60/100
Affected components and suppliers
Advanced Packaging
capacity-expansionadvanced-packaging
Source and time
Source: TrendForce · 4/15/2026 · View original source
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