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Toshiba and SICC sign MOU on silicon carbide power semi wafer collaboration
What happened
Toshiba Electronic Devices & Storage and Chinese SiC wafer supplier SICC have signed an MOU to explore collaboration on improving SiC wafer quality and expanding stable supply. The move aims to strengthen Toshiba's upstream supply chain for SiC power semiconductors, a key growth area. Neutral: This is a long-term strategic alignment with no immediate impact on wafer supply, pricing, or trading dynamics.
Impact and signal
Low impactImpact score: 12/100
Affected components and suppliers
SiC WafersSiC Power Semiconductors
Toshiba Electronic Devices & Storage CorpSICC Co Ltd
partnershipsupply-chainsic
Source and time
Source: Semiconductor Today · 8/26/2025 · View original source
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