NuAxiSemiconductor trade intelligence

TI simplifies Industrial Ethernet integration for connected factories with the industry's smallest fully featured, multiprotocol communications module

What happened

Texas Instruments (TI) (Nasdaq: TXN) announced on November 5, 2026 two new devices: the TICS100MOD multiprotocol communications system-on-module (SoM) and the TIOM2212 dual-channel IO-Link master, expanding its industrial communication portfolio. Built on TI's AM2612 microcontroller and DP83826AI Ethernet physical layer, the TICS100MOD is described as the industry's smallest fully featured, certified communications SoM, supporting EtherCAT, EtherNet/IP and Profinet on a single piece of hardware with firmware-based protocol switching at boot time; the TIOM2212 bridges IO-Link devices to higher-level Industrial Ethernet networks. Regarding availability, preproduction quantities of the TIOM2212 IO-Link master device are available now on TI.com, while the TICS100MOD SoM will be available by year-end 2026. TI will also display the multiprotocol industrial communication technology at electronica, November 10-13, in Munich, Germany (Hall C4, booth 159). This is a paid press release; the source does not state pricing, volumes or financial figures.