IIT Guwahati, Tata Electronics to advance chip packaging research

What happened

Indian Institute of Technology Guwahati (IIT Guwahati) has signed an MoU with Tata Electronics to strengthen semiconductor Assembly, Testing, Marking and Packaging (ATMP) education, skill development and research in India. The collaboration facilitates the establishment of a Centre of Excellence (CoE) at the IIT Guwahati campus, with a focus on developing industry-ready talent and advancing research in semiconductor packaging technologies. To address the growing need for a skilled workforce in the semiconductor industry, the collaboration will develop educational and training programs aligned with industry requirements, and will strengthen the semiconductor talent ecosystem in Assam and India's Northeast region by creating opportunities for students from engineering colleges, polytechnics and other educational institutions. Under this framework, IIT Guwahati will be responsible for leading the development and delivery of education programs. Prof. Devendra Jalihal, Director of IIT Guwahati, said the initiative aims to connect academic institutions, industry and students through specialised education, practical training and collaborative research.

Impact and signal

Affected components and suppliers

Source and time

Source: Evertiq · 11/2/2026 · View original source