Hirose Introduces Compact Floating Board-to-Board Connector for High-heat, High-Vibration Environments

What happened

Hirose has expanded its FunctionMAX™ family of floating board-to-board connectors with a high-density version designed for space-constrained, harsh-environment applications: the FX36 Series. Featuring a 0.5 mm pitch, the series supports high-density mounting, improves design flexibility, and contributes to application miniaturization, weight reduction, and more efficient automated assembly. With 125°C heat resistance, the connector targets automotive powertrain applications, particularly BEV and HEV multifunctional systems such as X-in-1 units with strict board layout requirements. It provides misalignment absorption of ±0.7 mm in the X and Y directions and ±0.5 mm in the Z direction, plus vibration absorption of 0.05 mm in the Z direction; a two-point contact design supports high-reliability connections in vibration-prone applications. The source does not state the cause beyond addressing demand for high-temperature, vibration-tolerant board-to-board connector options. This is a product introduction, a background-level event with no direct stated impact on procurement pricing.

Impact and signal

Affected components and suppliers

Source and time

Source: EE Journal · 10/21/2026 · View original source