Samsung Electro-Mechanics signs KRW 360.5bn memory substrate supply deal

What happened

Samsung Electro-Mechanics has signed a long-term supply agreement to provide package substrates for memory semiconductors to an unnamed global customer throughout 2027, in a deal worth KRW 360.5 billion (approximately USD 271 million), covering the period from January 1 to December 31, 2027. According to a press release from Samsung Electro-Mechanics, this is the first major order of this kind for its Package Solution Unit; its Component Solution Unit has signed similar agreements since May for silicon capacitors, MLCCs for AI servers and high-performance inductors. With this order, the company has signed seven long-term supply agreements since May 2026 that were large enough to require public disclosure, meaning each worth at least 2.5% of the company's sales, together totaling KRW 4.3 trillion (USD 3.2 billion). The company points to generative AI and high-performance computing increasing demand for high-bandwidth memory (HBM) and high-performance server DRAM modules, and notes that as memory chips become faster and more densely integrated, substrates connecting them to the main board need more layers, finer circuits and thinner designs. The company plans to expand long-term agreements with major customers to reduce exposure to volatile business cycles and says it will build closer supply cooperation and a stable supply system for the package substrate business as AI and HPC demand grows.

Impact and signal

Affected components and suppliers

Source and time

Source: Evertiq · 10/21/2026 · View original source