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Contrel, FSE combine laser and plasma processes for advanced packaging
What happened
Contrel Technology and FSE jointly showcased dual-core laser micromachining and plasma process technologies at TPCA Show 2026, targeting advanced packaging and high-end substrate manufacturing. The companies' solutions span key processes from surface treatment and residue removal to laser trimming, debonding, grooving, and cutting.
Impact and signal
Medium impactImpact score: 30/100
Affected components and suppliers
advanced packaginghigh-end substrate manufacturing
Contrel TechnologyFSE
laser micromachiningplasma processdual-core laserTPCA Show 2026advanced packagingsubstrate
Source and time
Source: DigiTimes Asia · 10/20/2026 · View original source
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