E&R opens Malaysia plant to expand packaging materials production

What happened

Taiwanese semiconductor packaging equipment provider E&R Engineering Corp. has announced the opening of its new Malaysian subsidiary, E&R Semiconductor (MALAYSIA) SDN. BHD., to expand packaging materials production capacity. The new facility is currently undergoing sample testing and qualification, with mass production scheduled to officially begin early next year, according to the company. The plant is expected to create 50 local job opportunities and will strengthen E&R's supply capabilities in Southeast Asia, delivering real-time technical support and supply chain flexibility to semiconductor and OSAT customers. President KS Chen said the Malaysia plant inauguration marks a milestone in the global deployment of the company's carrier tape business and, to address growing customer demand in Southeast Asia, the company has shifted part of its production focus to Malaysia while expanding capacity. General Manager AK Ong said the new facility allows the company to stay closer to its customers. This is a planned expansion; mass production has not yet begun.

Impact and signal

Affected components and suppliers

Source and time

Source: Evertiq · 10/19/2026 · View original source