NuAxiSemiconductor trade intelligence
Samsung, Micron, Hynix to use TSMC base dies for NVHBM
What happened
Nvidia has asked Samsung, Micron and Hynix to use TSMC 3nm base dies for its custom NVHBM, citing standardisation as the reason; Samsung and Micron have confirmed their agreement, with volume production expected in 2027; Hynix was already using TSMC’s 12nm process for HBM4 base dies; Samsung is also validating base-die production on its own 2nm process as a backup; Samsung will continue to make standard HBM for customers who do not want NVHBM. NVHBM offers up to 30.% more bandwidth and 15% lower power than standard HBM4E.
Impact and signal
Medium impactImpact score: 50/100
Affected components and suppliers
base die
BusinessNews
Source and time
Source: Electronics Weekly · 10/18/2026 · View original source
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