NuAxiSemiconductor trade intelligence

Taisic unveils p-type SiC substrate for ultra-high-voltage grid, rail applications

What happened

Taisic Materials unveiled a p-type SiC substrate on September 2 for ultra-high-voltage grid and rail applications. The product targets high-power electrical systems and is part of the Kenmec Group's compound semiconductor portfolio. This launch represents a new product entry into the SiC substrate market.

Impact and signal

Low impactImpact score: 10/100

Affected components and suppliers

p-type SiC substrate

Taisic Materials

SiCsubstratenew_product

Source and time

Source: DigiTimes Asia · 9/3/2026 · View original source

Open the NuAxi live feed →

Real-time pricing, supply signals and AI analysis for semiconductor traders

Infineon extends Wolfspeed wafer deal to 8-inch silicon carbideDigiTimes Asia · 10/18/2026
[News] NVIDIA Reportedly Opens Vera CPU Sales to China as Early as August as H200 Shipments StallTrendForce · 6/11/2026
xEV PMIC market to double to $14.5bn by 2031Electronics Weekly · 8/13/2026
Wolfspeed files for Chapter 11 bankruptcy as part of financial restructuringSemiconductor Today · 7/1/2025
Bosch gains $225m US CHIPS funding for $2bn transformation of Roseville fab for SiC productionSemiconductor Today · 7/16/2026
Infineon supplying CoolSiC MOSFETs 1200V and gate drivers to ADVANTICSSemiconductor Today · 7/8/2026

Taisic unveils p-type SiC substrate for ultra-high-voltage grid, rail applications

What happened

Impact and signal

Affected components and suppliers

Source and time

Related briefings