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Coherent launches bondable diamond solutions for thermal management
What happened
Coherent Corp has launched bondable diamond solutions for thermal management in semiconductor packaging. The technology aims to reduce thermal interface resistance for improved cooling in high-power electronic and opto-electronic devices. This is a long-term R&D development with no immediate impact on component supply, demand, or pricing.
Impact and signal
Low impactImpact score: 15/100
Affected components and suppliers
Thermal Interface MaterialsDiamond Substrates
Coherent Corp
product-launchthermal-managementpackaging
Source and time
Source: Semiconductor Today · 1/20/2026 · View original source
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