An Overview of Back-End-of-Line (BEOL) Integrated Magnetics

What happened

BEOL integrated magnetics technology embeds passive components into semiconductor manufacturing by depositing magnetic thin films and conductive windings onto CMOS wafers. This process utilizes standard metal interconnect steps and low-temperature deposition to create microinductor structures, reducing parasitic resistance and inductance. The technology is compatible with existing foundry infrastructure and offers benefits for power conversion systems.

Impact and signal

Affected components and suppliers

Source and time

Source: Power Electronics News · 7/24/2026 · View original source