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Hardinge demonstrating BoulePro-200AX for forming wafer-ready silicon carbide puck
What happened
Hardinge Inc. is demonstrating its BoulePro-200AX machine tool, which features Single-Step Dual-plane Compensation (SSDC) technology designed to streamline the shaping of silicon carbide boules into wafer-ready pucks. This represents a potential improvement in the efficiency of the SiC substrate manufacturing process, a critical bottleneck for power semiconductor production. Neutral: While this may improve long-term SiC substrate yields and supply, it is a single equipment demonstration with no immediate, quantifiable impact on market supply, demand, or pricing.
Impact and signal
Low impactImpact score: 10/100
Affected components and suppliers
Silicon Carbide (SiC) Substrates
manufacturing-efficiencywafer-fabrication
Source and time
Source: Semiconductor Today · 5/26/2023 · View original source
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