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CompoundTek and Hyper-silicon collaborate on silicon photonics high-volume wafer edge coupling test for datacom products
What happened
Singapore-based silicon photonics foundry CompoundTek has partnered with Chinese transceiver maker Hyper-silicon to establish a high-volume wafer edge coupling test solution for datacom products. The collaboration aims to reduce testing costs and improve production efficiency for silicon photonics components used in data centers. Neutral: This is a long-term R&D and process improvement initiative with no immediate impact on component supply, demand, or pricing.
Impact and signal
Low impactImpact score: 10/100
Affected components and suppliers
硅光子晶圆数据中心光模块
CompoundTek Pte LtdNingbo Hyper-silicon Technology Co Ltd
partnershiptest-capacitydatacenter
Source and time
Source: Semiconductor Today · 5/29/2023 · View original source
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