NuAxiSemiconductor trade intelligence

FlexIC RFID inlays bring NFC to paper packaging

What happened

Tageos and Pragmatic Semiconductor launched the first paper-based NFC inlay using the PR1301 chip, expanding their FlexIC RFID product line. This product targets the packaging industry but does not immediately impact spot prices.

Impact and signal

Low impactImpact score: 25/100

Affected components and suppliers

NFC inlayRFID inlayNFC Connect PR1301

TageosPragmatic Semiconductor

PR1301 EOS-932 Zero Lite PR1301

product_launchnfcrfid

Source and time

Source: eeNews Europe · 5/5/2026 · View original source

Open the NuAxi live feed →

Real-time pricing, supply signals and AI analysis for semiconductor traders

Tesla's AI5 with 2nm-class node tapes out at Samsung Foundry — production starts soon, months after TSMC tape outTom's Hardware · 7/13/2026
NVIDIA "N1X" Comes in Two SKUs: 20C CPU and 6,144C GPU or 18C CPU and 5,120C GPUTechPowerUp · 9/3/2026
SK hynix to Supply HBM4E Samples in Second Half Using 1c DRAMThe Elec · 4/24/2026
STMicroelectronics Secures Spot Alongside Qualcomm's New Wearable Chip PlatformThe Elec · 3/9/2026
TDK Expands Compact 500V Snap-In Capacitors for AI ServersPower Electronics News · 9/22/2026
Teradyne Targets Edge AI Test Costs With UltraFLEXplus S SeriesSemiWiki · 10/22/2026

FlexIC RFID inlays bring NFC to paper packaging

What happened

Impact and signal

Affected components and suppliers

Source and time

Related briefings