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Hanwha Semitech to Develop Wafer-to-Wafer Hybrid Bonding Equipment
What happened
Hanwha Semitech is developing wafer-to-wafer (W2W) hybrid bonding equipment to support front-end and advanced packaging processes. This move targets the logic chip market and aims to compete with market leader EV Group. The development of the 'SWB1' system signals a strategic expansion into advanced packaging capabilities.
Impact and signal
Low impactImpact score: 15/100
Affected components and suppliers
Wafer-to-Wafer Hybrid Bonding EquipmentLogic ChipsCIS
Hanwha SemitechEV Group
R&DW2WHybrid BondingLogic Chips
Source and time
Source: The Elec · 4/19/2026 · View original source
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